I spent two days touring Intel’s most advanced fab and talking to its technical leadership to understand what the chips of the future will look like. A lot of what's coming next – gate-all-around transistors, backside power, CFET, hybrid bonding – is hard to follow without actually seeing it, so we made all the awesome animated explainers that I wish I had while I was prepping. I also asked Intel’s leadership how the semiconductor industry will cope with the enormous shock in demand from…